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EGNOS Receivers: Difference between revisions
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==Receiver types== | ==Receiver types== | ||
EGNOS-enabled receivers can be designed using a chipset, hybrid component or auxiliary card. | |||
* Chipset: consists of one or two components that must be installed on a circuit board. The routing of the RF part is sensitive. This compact solution is also the least expensive. | |||
* Hybrid component: consists of a single component integrating the RF and signal processing parts to be installed on a circuit board. Routing is easier compared to chipsets. The price is higher than for the chipset solution. | |||
* Auxiliary card (piggyback): all the receiver and peripheral components are integrated on a ready-to-use card connected to the final product’s main circuit board. It is an ideal solution for prototyping embedded applications. This is the most expensive solution. | |||
==Communications protocols== | ==Communications protocols== | ||
Revision as of 16:03, 5 May 2011
| EGNOS | |
|---|---|
| Title | EGNOS Receivers |
| Author(s) | GMV. |
| Level | Basic |
| Year of Publication | 2011 |
EGNOS-enabled receiver depend on the targeted application, the EGNOS functions that will be used and the integration constraints. In choosing a receiver, users should establish whether it correctly supports EGNOS, then select the interface type. Check if the protocols supported by the receiver allow retrieval of the data required for the targeted application.[1]
Receiver types
EGNOS-enabled receivers can be designed using a chipset, hybrid component or auxiliary card.
- Chipset: consists of one or two components that must be installed on a circuit board. The routing of the RF part is sensitive. This compact solution is also the least expensive.
- Hybrid component: consists of a single component integrating the RF and signal processing parts to be installed on a circuit board. Routing is easier compared to chipsets. The price is higher than for the chipset solution.
- Auxiliary card (piggyback): all the receiver and peripheral components are integrated on a ready-to-use card connected to the final product’s main circuit board. It is an ideal solution for prototyping embedded applications. This is the most expensive solution.